BRG130 Thermal Paste
High-Performance Thermal Paste
BRG130 thermal paste is designed for higher performance computer and graphics processors and is suitable for gamers and overclockers as well as for increased cooling needs in power electronics.
![](https://www.buzrise.com/wp-content/uploads/2023/06/5years-150x150.png)
5 Years Durability
![](https://www.buzrise.com/wp-content/uploads/2023/06/spatula-150x150.png)
Spatula Included
![](https://www.buzrise.com/wp-content/uploads/2023/06/alcoholpad-150x150.png)
Alcohol Pad Included
Exceptional thermal conductivity
Buzrise thermal conductive pastes are developed according to the latest research and findings in the field of thermal management and thermal optimization. Our BRG130 Paste is composed of high-quality polymers and fillers with higher thermal conductivity.
The aim in developing the BRG130 thermal paste was to reduce the thermal resistance of the particles at low pressure and low viscosity in order to achieve the thinnest possible layer thickness and thus stable and high cooling performance.
The BRG130 series also offers excellent long-term stability, ensuring optimal cooling of your systems even after extended use.
We have succeeded in developing a paste that maintains a constant and high thermal conductivity even at very high temperatures, resulting in uniform and excellent cooling performance without substance loss or drying out.
![](https://www.buzrise.com/wp-content/uploads/2023/06/buzrise_cpu_thermal_paste-1024x683.jpg)
![](https://www.buzrise.com/wp-content/uploads/2023/06/brg130-p-1024x1024.jpg)
Specifications
Thermal Conductivity | ≤13W/m.k |
Density | 3.45 g/cm³ |
Operating Temp. | -50 ~ 300CO |
Minimal BLT | 25-30 |
Viscosity | 240 Pas |
Thermal impedance@ 40psi / 0.08mm | 0.003 °C‐in2/W |
Typical Applications
- PC Peripherals /Overclocking and Gaming Systems, High-Performance CPU and GPU, Gaming Consoles PS3/PS4/PS5, XBOX ONE
- HIGH END Server Systems
- AV High End Display Technology
- Laser Printing and 3D Equipment
- Power supplies, power transistors
- Telecommunication Equipment, SG Modul Unit
- DRONE Technology and AEROSPACE, Electrical Vehicles
- Automotive industry
Features
- HIGH Thermal conductivity: up to ≤13.0W/MK
- Low Thermal Resistance at low pressure
- High Cooling Performance
- Ultra Low Bond Thickness
- Good Application, Low Viscosity
- No corrosion or oxidation to any contact Surfaces
- Doesn ́t dry out.
- No electrical conductivity
- 100% ROHS Compliant
- Usage Guarantee Up to Five Years Shelf Live (Before Use)