Buzrise thermal conductive pastes are developed according to the latest research and findings in the field of thermal management and thermal optimization. Our BRG170 Paste is composed of high-quality polymers and fillers with higher thermal conductivity.

The goal is to reduce the thermal resistance of the particles at low pressure and low viscosity in order to achieve the thinnest possible layer thickness and thus stable and high cooling performance. The BRG170 series also offers excellent long-term stability, meaning your systems will continue to be optimally cooled even after prolonged use. 

We have succeeded in developing a paste that maintains a constant and high thermal conductivity even at very high temperatures, resulting in uniform and very good cooling performance without losing substance or drying out.